Senior Product Engineer
Product Lifecycle Engineer 4
Responsibilities:
Own PE activities for assigned FHS NPI programs from first silicon through mass production release; drive product conformance to specifications and seamless transfer to full-volume manufacturing
Lead wafer analysis and yield improvement initiatives; own yield loss Pareto, root cause investigation, and corrective action closure for CP and FT yield deviations
Own BOM reconstruction and maintenance in Agile PLM and SAP for all FHS test hardware and product configurations; maintain full documentation with no single-person knowledge dependency
Drive process improvement and CIP activities; monitor yield and quality metrics across processing steps, identify trends and anomalies, and implement targeted solutions
Lead manufacturing qualifications and data analysis for alternate OSAT qualification programs; coordinate handler qualification, correlation lot design, Cpk analysis, and sign-off matrices
Own RMA verification and customer escalation analysis; lead failure investigation and corrective action implementation to enhance FHS product quality and test coverage
Drive PAT/SBL/SYL implementation across FHS product families; establish statistical process control baselines at primary and alternate OSATs and integrate with yield analytics platforms
Support automotive qualification activities; assist in reliability testing coordination and qualification data package preparation
Collaborate with cross-functional teams including R&D, Test Engineering, Quality & Reliability, Applications Engineering, and Operations to drive NPI milestones and production continuity
Minimum Qualifications:
Bachelor’s degree in Electrical Engineering, Microelectronics, or related field; Master’s degree preferred
5+ years in semiconductor back-end product engineering; MEMS, analog mixed-signal, or force/capacitive sensing experience strongly preferred
Demonstrated yield analysis capability: parametric failure analysis, Cpk trending, SBL/SYL implementation, PAT outlier detection
Experience coordinating multi-OSAT qualification programs including correlation lot design and sign-off matrices
Working knowledge of Agile PLM or equivalent product lifecycle management system for BOM and ECO management
Proficiency in statistical analysis and data interpretation to drive yield improvements; familiarity with JMP or equivalent tools
Excellent problem-solving skills and attention to detail; must be a team player
Strong written and verbal communication skills; proficiency in English required; Mandarin working proficiency preferred
Desired Qualifications
Direct experience with MEMS force/pressure sensors, capacitive sensing, or haptic actuator characterization
Familiarity with OTP programming and validation.
Experience in automotive-grade semiconductor product engineering — familiarity with AEC-Q100 qualification flows, PPAP/APQP documentation, and automotive customer quality requirements (IATF 16949 awareness a plus).
Background in automotive haptic feedback or force-sensing applications strongly preferred; positions the candidate to engage directly with Semtech’s automotive FHS customer pipeline
Experience with coverage gap analysis of inherited test programs, including spec-level traceability and gap vs. escape classification methodology
Hands-on experience with ATE platforms (S100 or Advantest V93K) and familiarity with probe card and FT fixture bring-up
Knowledge of 6-sigma principles (black-belt as an advantage), DFM, and production GR&R methodologies
Proficiency in scripting or programming for data analysis and automation: Python, VBA, or equivalent
Demonstrated ability to work in a multi-OSAT, cross-functional team environment.
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Responsibilities:
Own PE activities for assigned FHS NPI programs from first silicon through mass production release; drive product conformance to specifications and seamless transfer to full-volume manufacturing
Lead wafer analysis and yield improvement initiatives; own yield loss Pareto, root cause investigation, and corrective action closure for CP and FT yield deviations
Own BOM reconstruction and maintenance in Agile PLM and SAP for all FHS test hardware and product configurations; maintain full documentation with no single-person knowledge dependency
Drive process improvement and CIP activities; monitor yield and quality metrics across processing steps, identify trends and anomalies, and implement targeted solutions
Lead manufacturing qualifications and data analysis for alternate OSAT qualification programs; coordinate handler qualification, correlation lot design, Cpk analysis, and sign-off matrices
Own RMA verification and customer escalation analysis; lead failure investigation and corrective action implementation to enhance FHS product quality and test coverage
Drive PAT/SBL/SYL implementation across FHS product families; establish statistical process control baselines at primary and alternate OSATs and integrate with yield analytics platforms
Support automotive qualification activities; assist in reliability testing coordination and qualification data package preparation
Collaborate with cross-functional teams including R&D, Test Engineering, Quality & Reliability, Applications Engineering, and Operations to drive NPI milestones and production continuity
Minimum Qualifications:
Bachelor’s degree in Electrical Engineering, Microelectronics, or related field; Master’s degree preferred
5+ years in semiconductor back-end product engineering; MEMS, analog mixed-signal, or force/capacitive sensing experience strongly preferred
Demonstrated yield analysis capability: parametric failure analysis, Cpk trending, SBL/SYL implementation, PAT outlier detection
Experience coordinating multi-OSAT qualification programs including correlation lot design and sign-off matrices
Working knowledge of Agile PLM or equivalent product lifecycle management system for BOM and ECO management
Proficiency in statistical analysis and data interpretation to drive yield improvements; familiarity with JMP or equivalent tools
Excellent problem-solving skills and attention to detail; must be a team player
Strong written and verbal communication skills; proficiency in English required; Mandarin working proficiency preferred
Desired Qualifications
Direct experience with MEMS force/pressure sensors, capacitive sensing, or haptic actuator characterization
Familiarity with OTP programming and validation.
Experience in automotive-grade semiconductor product engineering — familiarity with AEC-Q100 qualification flows, PPAP/APQP documentation, and automotive customer quality requirements (IATF 16949 awareness a plus).
Background in automotive haptic feedback or force-sensing applications strongly preferred; positions the candidate to engage directly with Semtech’s automotive FHS customer pipeline
Experience with coverage gap analysis of inherited test programs, including spec-level traceability and gap vs. escape classification methodology
Hands-on experience with ATE platforms (S100 or Advantest V93K) and familiarity with probe card and FT fixture bring-up
Knowledge of 6-sigma principles (black-belt as an advantage), DFM, and production GR&R methodologies
Proficiency in scripting or programming for data analysis and automation: Python, VBA, or equivalent
Demonstrated ability to work in a multi-OSAT, cross-functional team environment.
#LI-Onsite
Apply To This Job