[Remote] Senior ASIC Package Design Engineer

Note: The job is a remote job and is open to candidates in USA. K2 Space Corporation is focused on building the largest and highest-power satellites for various missions. They are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture and collaborate with internal teams to ensure successful design and production of high-performance mixed-signal and digital SoCs.ResponsibilitiesDefine ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraintsLead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliabilityEstablish package design standards, methodologies, and best practicesDrive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal contentDefine and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planningPartner with silicon, RF, and systems teams to co-optimize die floorplans and package interfacesSupport package-level SI/PI strategy, including high-speed digital interfaces, power delivery network (PDN) design, and decoupling strategyLead thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system coolingDrive material selection, substrate technology choices, and assembly process optimizationSkillsBachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field5+ years of experience in ASIC package design, with deep expertise in FC-BGAProven experience delivering high-pin-count, high-performance ASIC packages into productionStrong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICsFluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADSExperience working directly with OSATs and substrate vendorsKnowledge of packaging qualification and test methodologiesExperience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates)Background in high-speed digital or mixed-signal SoCsFamiliarity with aerospace, space, or high-reliability electronicsBenefitsEquity in the companyComprehensive benefits package including paid time off, medical/dental/vision/ coverage, life insurance, paid parental leave, and many other perksCompany OverviewMaking previously impossible missions possible It was founded in 2022, and is headquartered in Torrance, California, USA, with a workforce of 51-200 employees. Its website is https://www.k2space.com.