[Remote] MGR II - R&D/Product Development Engineering (High Speed IO)

Note: The job is a remote job and is open to candidates in USA. TE Connectivity is a global industrial technology leader creating a safer, sustainable, productive, and connected future. As a Product Development Engineering Manager, you will lead a team responsible for the research, design, and development of High Speed IO products, ensuring robust product design and successful commercialization.ResponsibilitiesLead team to research, develop, and sustain High Speed IO products across full lifecycle (concept to mass production)Manage performance goals aligned with organization strategy; conduct regular reviews and feedbackOversee end-to-end new product development (NPI) including design, simulation, validation, and releaseCoach and develop team members to build a high-performance engineering organizationDrive continuous improvement of engineering tools, methodologies, and development processesDefine and execute High Speed IO technology roadmap aligned with industry trends and customer needsWork closely with customers, sales, and PM to capture Voice of Customer (VOC), especially system-level SI requirementsLead engineering execution following LEANPD/stage-gate processes, ensuring delivery on time, quality, and costDevelop and maintain product documentation: specifications, SI reports, design guidelines, test plans, and validation reportsCollaborate with global manufacturing, procurement, and suppliers to meet technical, quality, and cost targetsLead component and technology qualification, especially for high-speed materials and signal-critical structuresEnsure thorough design verification & validation, including SI/Thermal simulations, high-speed measurements (TDR, VNA, eye diagram, BER)Partner with manufacturing teams to ensure smooth product ramp and yield optimizationProvide strong technical interface to customers on system integration, debugging, and performance optimizationConduct competitive analysis and track industry trends in high-speed interconnect technologiesBuild deep understanding of system-level applications (servers, switches, accelerators, etc.)Drive innovation through collaboration with global teams and technology centersApply engineering best practices to optimize performance, cost, and manufacturabilitySkillsBachelor's degree with 10+ years experience, ORMaster's degree with 6+ years, ORPhD with 3+ yearsMinimum3+ years leadership/people management experienceStrong background in electrical/mechanical engineering with emphasis on high-speed interconnect designDeep expertise in High Speed IO technologies, including:Signal Integrity (SI) and ThermalHigh-speed protocols (PCIe, Ethernet, MSA, CXL, etc.)Channel modeling and link budget analysisExperience with product development lifecycle (design, prototyping, testing, qualification)Familiarity with simulation and design tools: SI tools (e.g., HFSS)3D CAD and mechanical design toolsKnowledge of materials for high-speed applications (low-loss dielectric, plating, cable structures)Understanding of manufacturing processes (stamping, molding, plating, assembly, etc.)Experience with reliability, compliance, and high-speed test methodologiesFamiliarity with quality tools (FMEA, DOE, Six Sigma, 8D)BenefitsA comprehensive benefits package including health insurance, 401(k), disability, life insurance, employee stock purchase plan, paid time off and voluntary benefits.Company OverviewTE Connectivity provides and markets engineered electronic components, network solutions, and specialty products. It was founded in 1941, and is headquartered in Schaffhausen, Schaffhausen, CHE, with a workforce of 10001+ employees. Its website is http://www.te.com.Company H1B SponsorshipTE Connectivity has a track record of offering H1B sponsorships, with 22 in 2026, 85 in 2025, 75 in 2024, 103 in 2023, 93 in 2022, 81 in 2021, 76 in 2020. Please note that this does not guarantee sponsorship for this specific role.