Substrate IC Package Design Engineer - Remote
About Syenta
Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste.
Founded in Australia, our growing footprint in the US represents a key milestone in our journey. We are building a world-class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing.
About the Role
This role is a critical addition to Syenta’s technical capabilities, enabling in-house design of advanced substrate IC packages and multi-layered interposers. You will play a foundational role in developing designs that underpin next-generation packaging architectures, including high-performance chip-to-chip integration approaches.
Working at the intersection of electrical, thermal, and mechanical design, you will lead the development of complex substrate layouts that directly enable fabrication and deployment of our platform.
This is a highly technical, hands-on role with immediate impact, where your work will directly unlock fabrication and influence the future direction of our technology.
Responsibilities
Substrate & Interposer Design
• Design large (>50mm), complex multi-layer substrate interposers with high pin counts and dense routing requirements
• Develop high-speed signal routing solutions capable of supporting >50GHz performance while minimizing signal integrity issues such as loss and crosstalk
• Ensure robust signal integrity (SI) and power integrity (PI) across all designs
• Optimize designs for thermal performance and reliability
Design Validation & Documentation
• Perform DRC (Design Rule Check) and LVS (Layout vs. Schematic) verification for all substrate designs
• Develop and maintain detailed design documentation, specifications, and reusable guidelines for future interposer and substrate development
Cross-Functional Collaboration
• Work closely with global, cross-functional teams across engineering disciplines to ensure design feasibility, manufacturability, and performance
• Partner with process, materials, and hardware teams to align design with fabrication capabilities and constraints
Technical Leadership & Development
• Contribute to the establishment of internal best practices for substrate and interposer design
• Provide expertise in advanced packaging design, helping build this capability within Syenta
Requirements
• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field
• 5+ years of experience in substrate IC package design for high-performance processors or accelerators
• Extensive experience designing large-format substrate packages (>50mm) with complex, high-density layouts
• Deep expertise in high-speed signal design, including mitigation of crosstalk, reflections, and impedance mismatches
• Advanced proficiency in Allegro Package Designer (constraint management, routing, and design verification)
• Strong understanding of SI/PI principles and their application to package-level design
• Solid foundational knowledge across electrical, materials, thermal, and/or mechanical engineering disciplines
• Working knowledge of substrate manufacturing processes, design rules, and material properties
• Strong analytical and problem-solving skills, with the ability to operate effectively in a fast-paced, cross-functional environment
Preferred Qualifications
• Familiarity with Valor CAM350 or Calibre for package design reviews
• Experience designing for advanced packaging architectures (e.g. multi-chip modules, interposers, or similar high-density systems)
• Experience working in high-growth or startup environments
Why Choose Syenta?
We’re passionate about building a diverse, people-first company. We believe that our culture of collaboration and mutual respect fuels the kind of innovation that can redefine an industry.
What We Offer
• Salary Range: US $130k – $160k (negotiable)
• Early-stage equity opportunities
• Potential 401(k) and other benefits
• Comprehensive health, dental, and vision coverage plans, supported by Company
• Professional Growth – We’re scaling fast, so responsibilities can expand significantly in tandem with the business
• Team Events – Annual company event in Australia to collaborate and celebrate
• Work-Life Balance – Flexible leave policies and an understanding that meaningful work can coexist with a fulfilling personal life
• 15 days PTO and 10 days sick leave
Syenta is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, age, or any other characteristic protected by law.
Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste.
Founded in Australia, our growing footprint in the US represents a key milestone in our journey. We are building a world-class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing.
About the Role
This role is a critical addition to Syenta’s technical capabilities, enabling in-house design of advanced substrate IC packages and multi-layered interposers. You will play a foundational role in developing designs that underpin next-generation packaging architectures, including high-performance chip-to-chip integration approaches.
Working at the intersection of electrical, thermal, and mechanical design, you will lead the development of complex substrate layouts that directly enable fabrication and deployment of our platform.
This is a highly technical, hands-on role with immediate impact, where your work will directly unlock fabrication and influence the future direction of our technology.
Responsibilities
Substrate & Interposer Design
• Design large (>50mm), complex multi-layer substrate interposers with high pin counts and dense routing requirements
• Develop high-speed signal routing solutions capable of supporting >50GHz performance while minimizing signal integrity issues such as loss and crosstalk
• Ensure robust signal integrity (SI) and power integrity (PI) across all designs
• Optimize designs for thermal performance and reliability
Design Validation & Documentation
• Perform DRC (Design Rule Check) and LVS (Layout vs. Schematic) verification for all substrate designs
• Develop and maintain detailed design documentation, specifications, and reusable guidelines for future interposer and substrate development
Cross-Functional Collaboration
• Work closely with global, cross-functional teams across engineering disciplines to ensure design feasibility, manufacturability, and performance
• Partner with process, materials, and hardware teams to align design with fabrication capabilities and constraints
Technical Leadership & Development
• Contribute to the establishment of internal best practices for substrate and interposer design
• Provide expertise in advanced packaging design, helping build this capability within Syenta
Requirements
• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field
• 5+ years of experience in substrate IC package design for high-performance processors or accelerators
• Extensive experience designing large-format substrate packages (>50mm) with complex, high-density layouts
• Deep expertise in high-speed signal design, including mitigation of crosstalk, reflections, and impedance mismatches
• Advanced proficiency in Allegro Package Designer (constraint management, routing, and design verification)
• Strong understanding of SI/PI principles and their application to package-level design
• Solid foundational knowledge across electrical, materials, thermal, and/or mechanical engineering disciplines
• Working knowledge of substrate manufacturing processes, design rules, and material properties
• Strong analytical and problem-solving skills, with the ability to operate effectively in a fast-paced, cross-functional environment
Preferred Qualifications
• Familiarity with Valor CAM350 or Calibre for package design reviews
• Experience designing for advanced packaging architectures (e.g. multi-chip modules, interposers, or similar high-density systems)
• Experience working in high-growth or startup environments
Why Choose Syenta?
We’re passionate about building a diverse, people-first company. We believe that our culture of collaboration and mutual respect fuels the kind of innovation that can redefine an industry.
What We Offer
• Salary Range: US $130k – $160k (negotiable)
• Early-stage equity opportunities
• Potential 401(k) and other benefits
• Comprehensive health, dental, and vision coverage plans, supported by Company
• Professional Growth – We’re scaling fast, so responsibilities can expand significantly in tandem with the business
• Team Events – Annual company event in Australia to collaborate and celebrate
• Work-Life Balance – Flexible leave policies and an understanding that meaningful work can coexist with a fulfilling personal life
• 15 days PTO and 10 days sick leave
Syenta is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, age, or any other characteristic protected by law.