[Remote] Senior Packaging Technical Engineer - Hardware

Note: The job is a remote job and is open to candidates in USA. NVIDIA is a leading technology company focused on harnessing the potential of AI to revolutionize computing. The role involves driving technology across multiple functions, with responsibilities including defining and implementing chip pad rings and collaborating with various engineering teams.ResponsibilitiesYour responsibilities include defining and implementing the chip pad ring, substrate interconnect scheme, and lead the package layout design processWe collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and ManagersWork to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package!Communicate effectively with various teams throughout the companySkillsBSEE or equivalent experienceMinimum of 8+ years in board/system designGood understanding of transmission line theory, power delivery and signal integrityHardworking and able to work with a minimum of supervisionYou seek to solve complex technical problemsExperience with package designProgramming and scripting skills in Perl, Python, TclCadence Skill and EXCEL familiarityBenefitsEquityA comprehensive benefits packageCompany OverviewNVIDIA is a computing platform company operating at the intersection of graphics, HPC, and AI. It was founded in 1993, and is headquartered in Santa Clara, California, USA, with a workforce of 10001+ employees. Its website is https://www.nvidia.com.Company H1B SponsorshipNVIDIA has a track record of offering H1B sponsorships, with 448 in 2026, 1872 in 2025, 1354 in 2024, 976 in 2023, 835 in 2022, 601 in 2021, 529 in 2020. Please note that this does not guarantee sponsorship for this specific role.