[Remote] IC Package Design Researcher
Note: The job is a remote job and is open to candidates in USA. NOKIA is seeking an IC Package Design Researcher to realize next-generation packaging solutions by identifying, integrating, and validating novel materials. This role involves cross-functional collaboration with various teams to drive package design and ensure reliability-by-design.
Responsibilities
ā¢ Identify, integrate, and qualify novel materials into advanced microelectronics packages (e.g., dielectrics, interconnects, adhesives, TIMs, etc.)
ā¢ Drive package and test fixture design from architecture planning to CAD generation to system level validation, including mechanical, thermal, electrical, and optical design and accelerated reliability testing
ā¢ Plan and execute material and package characterization and failure analysis
ā¢ Collaborate with OSATs, Foundries, and material suppliers to validate new process flows and materials and identify and resolve failure mechanisms
ā¢ Build data-backed acceptance criteria for novel materials and correlate lab measurements with modeling results to inform design trade-offs
Skills
ā¢ M.S. or Ph.D in Materials Science/Engineering, Mechanical Engineering, Electrical Engineering, Physics, Chemistry or a related field, with 5+ years in microelectronics packaging
ā¢ Hands-on experience with at least some of the following tools for package and system design (e.g., Cadence Allegro, Xpedition, Altium) and mechanical/thermal/EM simulation (e.g. Creo/Solidworks, Ansys Mechanical, FloTHERM/Icepak, HFSS, CST)
ā¢ Proficiency in characterization methods and failure analysis (Radiography, RF S-parameters, optical insertion loss, DMA/TMA, SEM, AFM, etc.)
ā¢ Experience with wafer-level and substrate fabrication processes and the ability to identify and de-risk new processes
ā¢ Strong cross-functional collaboration and communication skills, with the ability to translate complex experimental data into clear design and process recommendations for both technical and non-technical stakeholders
Company Overview
ā¢ Nokia manufactures mobile devices, network infrastructure, and location-based technology for businesses. It is a sub-organization of Enscryb. It was founded in 1865, and is headquartered in Espoo, Southern Finland, FIN, with a workforce of 10001+ employees. Its website is http://www.nokia.com.
Company H1B Sponsorship
ā¢ Nokia has a track record of offering H1B sponsorships, with 262 in 2025, 264 in 2024, 259 in 2023, 250 in 2022, 296 in 2021, 287 in 2020. Please note that this does not guarantee sponsorship for this specific role.
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Responsibilities
ā¢ Identify, integrate, and qualify novel materials into advanced microelectronics packages (e.g., dielectrics, interconnects, adhesives, TIMs, etc.)
ā¢ Drive package and test fixture design from architecture planning to CAD generation to system level validation, including mechanical, thermal, electrical, and optical design and accelerated reliability testing
ā¢ Plan and execute material and package characterization and failure analysis
ā¢ Collaborate with OSATs, Foundries, and material suppliers to validate new process flows and materials and identify and resolve failure mechanisms
ā¢ Build data-backed acceptance criteria for novel materials and correlate lab measurements with modeling results to inform design trade-offs
Skills
ā¢ M.S. or Ph.D in Materials Science/Engineering, Mechanical Engineering, Electrical Engineering, Physics, Chemistry or a related field, with 5+ years in microelectronics packaging
ā¢ Hands-on experience with at least some of the following tools for package and system design (e.g., Cadence Allegro, Xpedition, Altium) and mechanical/thermal/EM simulation (e.g. Creo/Solidworks, Ansys Mechanical, FloTHERM/Icepak, HFSS, CST)
ā¢ Proficiency in characterization methods and failure analysis (Radiography, RF S-parameters, optical insertion loss, DMA/TMA, SEM, AFM, etc.)
ā¢ Experience with wafer-level and substrate fabrication processes and the ability to identify and de-risk new processes
ā¢ Strong cross-functional collaboration and communication skills, with the ability to translate complex experimental data into clear design and process recommendations for both technical and non-technical stakeholders
Company Overview
ā¢ Nokia manufactures mobile devices, network infrastructure, and location-based technology for businesses. It is a sub-organization of Enscryb. It was founded in 1865, and is headquartered in Espoo, Southern Finland, FIN, with a workforce of 10001+ employees. Its website is http://www.nokia.com.
Company H1B Sponsorship
ā¢ Nokia has a track record of offering H1B sponsorships, with 262 in 2025, 264 in 2024, 259 in 2023, 250 in 2022, 296 in 2021, 287 in 2020. Please note that this does not guarantee sponsorship for this specific role.
Apply tot his job
Apply To this Job