[Remote] Advanced Packaging & Power Delivery Senior Engineer

Note: The job is a remote job and is open to candidates in USA. Axelera AI is a pioneering deep-tech startup focused on creating next-generation AI platforms. They are seeking a Senior Advanced Packaging & Power Delivery Engineer to lead the design and architecture of power delivery systems for advanced AI accelerators, ensuring optimal performance and integration across silicon and packaging.ResponsibilitiesOwn power-delivery design end to end, from on-die power grids to package and PCB PDN design and analysisLead advanced packaging architecture decisions for 2.5D/3D stacking, multi-chiplet integration, and interposer/substrate co-designPerform SI/PI verification and sign-off across the full stack, ensuring power integrity and signal integrity targets are metCollaborate with the AIIS and Silicon Engineering teams to align power delivery and packaging solutions with product and silicon requirementsSupport thermal and integration reviews for current and future productsDevelop and maintain power-delivery methodology, flows, and design guidelines within the Custom Design toolchainIdentify and mitigate single-point-of-failure risks in SI/PI workstreams; mentor and grow the team's packaging expertiseEngage with external partners, substrate/interposer vendors, and OSAT houses to co-develop advanced packaging solutionsSkillsBachelor's or Master's degree in Electrical Engineering, Microelectronics, or a related field; PhD is a plus7+ years of experience in power delivery and/or advanced packaging design in a semiconductor or deep-tech environmentDemonstrated expertise in on-die power grid design and package/PCB PDN analysisHands-on experience with 2.5D and/or 3D IC packaging technologies, multi-chiplet integration, and interposer/substrate co-designProficiency with industry-standard EDA tools for power integrity, PDN simulation, and package designAbility to work cross-functionally and communicate complex technical trade-offs to diverse stakeholder groupsStrong written and spoken English communication skillsExperience with SI/PI verification and sign-off methodologiesFamiliarity with thermal modeling and co-simulation for integrated packagesExposure to AI accelerator or custom ASIC design flowsExperience collaborating with OSAT partners, substrate vendors, or research institutes (e.g., imec)Knowledge of advanced node custom and analog design practicesBenefitsPension planExtensive employee insurancesOption to get company sharesFlexible working arrangementWork from one of our Axelera AI offices (Leuven in Belgium, Amsterdam and Eindhoven in the Netherlands, Zurich in Switzerland, Florence and Milan in Italy or Bristol in the United Kingdom) if you're already based in the vicinity.Work fully remotely from any European country (incl. the UK) you are already in.Relocate with us and work from Italy (Florence or Milan) or the Netherlands (Amsterdam or Eindhoven).An open culture that supports creativity and continual innovationCollaborative ownership and freedom with responsibilityCompany OverviewAxelera AI develops purpose-built AI hardware acceleration technology for computer vision and generative AI applications. It was founded in 2021, and is headquartered in Eindhoven, Noord-Brabant, NLD, with a workforce of 201-500 employees. Its website is https://www.axelera.ai.