Packaging Module Development Engineer
Intel Corporation is a leader in semiconductor technology, particularly in packaging solutions for mobile and edge computing. The Packaging Module Development Engineer will be responsible for advancing packaging technology, collaborating with teams to optimize assembly processes, and managing projects related to high-volume manufacturing. Responsibilities Contribute to the advancement of technology and foundry capabilities by developing First‑Level and Second‑Level Interconnect (FLI/SLI) and thermal solutions to support Intel’s future packaging platforms Collaborate with multifunctional, cross‑organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability Drive innovation in next‑generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high‑volume manufacturing Manage projects to ensure alignment with product development schedules and execution milestones Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges Provide sustaining engineering support to maintain equipment performance and process health in high‑volume manufacturing environments Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events Skills PhD with one or more years in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field Minimum cumulative GPA of 3.5 At least one publication in a peer-reviewed technical journal Must have the required degree prior to your start date One or more years of experience in one or more of the following areas: Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE) Delivery of results for complex, time-critical technical projects Semiconductor fabrication processes and technologies Prior related work experience within a semiconductor foundry Benefits Competitive pay Stock bonuses Benefit programs which include health, retirement, and vacation Company Overview Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. It was founded in 1968, and is headquartered in Santa Clara, California, US, with a workforce of 10001+ employees. Its website is Company H1B Sponsorship Intel Corporation has a track record of offering H1B sponsorships, with 2793 in 2025, 3717 in 2024, 3576 in 2023, 4811 in 2022, 3359 in 2021, 1174 in 2020. Please note that this does not guarantee sponsorship for this specific role.