Director of System Hardware Engineering
Who We Are
We are a stealth-mode startup building foundational technology to address performance, scalability, and resiliency challenges in large-scale AI data center clusters. We are backed by top-tier VC firms and notable angel investors.
The company is led by experienced builders and operators who have founded companies, taken them to scale, and exited successfully. We work with a strong sense of unity and shared responsibility, and we expect trust, integrity, and respect in how we collaborate and make decisions. We hold ourselves accountable to one another and to the quality of the work we deliver.
Headquartered in Silicon Valley, we operate across a mix of remote and on-site locations in the U.S. and Canada. We aim to create an environment where people are treated fairly, supported in their growth, and are empowered to do meaningful work alongside others who take the craft seriously.
What We Need
We are seeking a seasoned Director of System Hardware Engineering to lead the architectural definition, design, and validation of high-performance server systems and advanced semiconductor packaging technologies. As a key technical leader, you will manage a multidisciplinary team to deliver next-generation data center hardware from concept to production, driving innovation in chiplet integration, high-speed board design, and thermal management.
Key Responsibilities
• Define the technical roadmap for server hardware platforms and advanced package technologies (e.g., 2.5D/3D IC, chiplets, system-in-package).
• Oversee end-to-end system design, including high-speed board-level hardware, ASIC packaging, SI/PI simulations, and PCB layout.
• Lead and mentor a multidisciplinary team of electrical, mechanical, and package engineers.
• Partner with silicon design, firmware, software, and manufacturing teams to ensure integration and manufacturability (DFM/DFT).
• Interface with OSAT and ODM partners to drive packaging technologies, prototype builds, and manufacturing quality.
• Guide system bring-up, validation, and debug, including thermal and power management.
• Own the full hardware lifecycle from concept through volume production, including schedules and budgets.
Required Skills And Qualifications
• BS, MS, or PhD in Electrical Engineering, Computer Engineering, or Materials Science.
• 10+ years of experience in hardware system design, including at least 5+ years in a technical leadership or management role.
• Deep expertise in server architecture, data center hardware, and high-speed interfaces (PCIe Gen5/6, DDR5/6, CXL).
• Strong knowledge of advanced chip packaging techniques such as chiplets, interposers, and flip-chip BGA.
• Proficiency with simulation tools (ANSYS HFSS/SIwave, Cadence Sigrity, Mentor Graphics) and PCB CAD tools (Allegro or similar).
• Demonstrated experience leading multidisciplinary teams and delivering complex, high-volume hardware products.
• Excellent verbal and written communication skills.
Desired Skills
• Experience with advanced cooling solutions (liquid cooling, vapor chambers) for high-TDP servers.
• Knowledge of scripting languages for automation (Python, Tcl).
• Record of patents or technical publications in semiconductor packaging.
Special Requirements
This position will require moderate travel to meet with team members and visit partners and suppliers, including ODMs in Asia.
Compensation
Target base salary for this role is $220,000 – $300,000 per year, plus meaningful equity, benefits, and 401(k). Salary ranges are determined by role, level, experience, and location.
Agency Note
We do not accept resumes from agencies or search firms. Please do not forward candidate profiles through our careers page, email, LinkedIn messages, or directly to company employees. Any resumes submitted will be deemed the property of the company, and no fees will be paid in the event the candidate is hired..
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We are a stealth-mode startup building foundational technology to address performance, scalability, and resiliency challenges in large-scale AI data center clusters. We are backed by top-tier VC firms and notable angel investors.
The company is led by experienced builders and operators who have founded companies, taken them to scale, and exited successfully. We work with a strong sense of unity and shared responsibility, and we expect trust, integrity, and respect in how we collaborate and make decisions. We hold ourselves accountable to one another and to the quality of the work we deliver.
Headquartered in Silicon Valley, we operate across a mix of remote and on-site locations in the U.S. and Canada. We aim to create an environment where people are treated fairly, supported in their growth, and are empowered to do meaningful work alongside others who take the craft seriously.
What We Need
We are seeking a seasoned Director of System Hardware Engineering to lead the architectural definition, design, and validation of high-performance server systems and advanced semiconductor packaging technologies. As a key technical leader, you will manage a multidisciplinary team to deliver next-generation data center hardware from concept to production, driving innovation in chiplet integration, high-speed board design, and thermal management.
Key Responsibilities
• Define the technical roadmap for server hardware platforms and advanced package technologies (e.g., 2.5D/3D IC, chiplets, system-in-package).
• Oversee end-to-end system design, including high-speed board-level hardware, ASIC packaging, SI/PI simulations, and PCB layout.
• Lead and mentor a multidisciplinary team of electrical, mechanical, and package engineers.
• Partner with silicon design, firmware, software, and manufacturing teams to ensure integration and manufacturability (DFM/DFT).
• Interface with OSAT and ODM partners to drive packaging technologies, prototype builds, and manufacturing quality.
• Guide system bring-up, validation, and debug, including thermal and power management.
• Own the full hardware lifecycle from concept through volume production, including schedules and budgets.
Required Skills And Qualifications
• BS, MS, or PhD in Electrical Engineering, Computer Engineering, or Materials Science.
• 10+ years of experience in hardware system design, including at least 5+ years in a technical leadership or management role.
• Deep expertise in server architecture, data center hardware, and high-speed interfaces (PCIe Gen5/6, DDR5/6, CXL).
• Strong knowledge of advanced chip packaging techniques such as chiplets, interposers, and flip-chip BGA.
• Proficiency with simulation tools (ANSYS HFSS/SIwave, Cadence Sigrity, Mentor Graphics) and PCB CAD tools (Allegro or similar).
• Demonstrated experience leading multidisciplinary teams and delivering complex, high-volume hardware products.
• Excellent verbal and written communication skills.
Desired Skills
• Experience with advanced cooling solutions (liquid cooling, vapor chambers) for high-TDP servers.
• Knowledge of scripting languages for automation (Python, Tcl).
• Record of patents or technical publications in semiconductor packaging.
Special Requirements
This position will require moderate travel to meet with team members and visit partners and suppliers, including ODMs in Asia.
Compensation
Target base salary for this role is $220,000 – $300,000 per year, plus meaningful equity, benefits, and 401(k). Salary ranges are determined by role, level, experience, and location.
Agency Note
We do not accept resumes from agencies or search firms. Please do not forward candidate profiles through our careers page, email, LinkedIn messages, or directly to company employees. Any resumes submitted will be deemed the property of the company, and no fees will be paid in the event the candidate is hired..
Apply tot his job
Apply To this Job